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Rumah > Produk > Mikrosfer kaca berongga > Hollow Glass Microspheres: Ultra-lightweight Thermal Insulation Solution with Chemical Stability for Marine and Industrial Applications

Hollow Glass Microspheres: Ultra-lightweight Thermal Insulation Solution with Chemical Stability for Marine and Industrial Applications

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Menyoroti:
Penampilan:
Bubuk putih mengalir, bola berongga transparan mikroskopis
Kata kunci:
Gelembung Kaca
Penggunaan:
Anti Korosi Laut, Pipa Industri Dan Tangki Penyimpanan
Warna:
warna putih
MAQ:
1 ton
Kata kunci:
Gelembung Kaca
Penampilan:
Bubuk putih mengalir, bola berongga transparan mikroskopis
Kata kunci:
Gelembung Kaca
Penggunaan:
Anti Korosi Laut, Pipa Industri Dan Tangki Penyimpanan
Warna:
warna putih
MAQ:
1 ton
Kata kunci:
Gelembung Kaca
Deskripsi Produk
Micro Glass Beads: Protective Thermal Insulation Solution
Product Overview

Hollow glass microspheres are a high-end, high-performance micron-sized hollow spherical material widely used across various industries. Manufactured from premium inorganic raw materials through advanced processes including precise proportioning, high-temperature melting, spray granulation, sintering, classification screening, and surface modification, they offer exceptional properties including light weight, high strength, low thermal conductivity, chemical stability, and excellent fluidity.

Our company has extensive experience in the new materials field, with mature production processes, strict quality control systems, and professional R&D teams. We provide hollow glass microspheres with complete specifications, stable quality, and superior performance, along with customized production solutions. Our commitment to quality, service, and cost-effectiveness has earned us the long-term trust of domestic and international customers.

Hollow Glass Microspheres: Ultra-lightweight Thermal Insulation Solution with Chemical Stability for Marine and Industrial Applications 0 Hollow Glass Microspheres: Ultra-lightweight Thermal Insulation Solution with Chemical Stability for Marine and Industrial Applications 1 Hollow Glass Microspheres: Ultra-lightweight Thermal Insulation Solution with Chemical Stability for Marine and Industrial Applications 2 Hollow Glass Microspheres: Ultra-lightweight Thermal Insulation Solution with Chemical Stability for Marine and Industrial Applications 3
Technical Specifications
Physical Parameters
Project Indicator Range
Appearance White flowing powder, microscopic transparent hollow spheres
True density 0.13-0.80 g/cm³
Bulk density 0.08-0.35 g/cm³
Compressive strength 4-207 MPa / 500-30000 psi
Particle size D50 10-80 μm
Particle size D90 15-120 μm
Thermal conductivity 0.038-0.060 W/m*K
Melting point 1200-1450℃
Softening point 600-650℃
pH value Alkalescence 7-9
Moisture content ≤0.5%
Liquidity Excellent, easy to disperse, easy to pump
Chemical Composition
Component Name Chemical Formula Content Percentage (wt%) Notes
Silicon dioxide SiO₂ 92.0% - 99.0% Core component, determining chemical stability, high-temperature resistance, insulation properties
Boron trioxide B₂O₃ 0.5% - 3.0% Improving glass strength, heat resistance, fluidity during melting
Calcium oxide CaO 0.3% - 2.0% Helping to melt, stabilizing glass structure
Magnesium oxide MgO 0.2% - 1.5% Enhancing water resistance, mechanical strength
Sodium oxide Na₂O 0.1% - 1.0% Melt regulator, adjusting melting temperature
Potassium oxide K₂O 0.1% - 0.8% Assisting in melting, improving processing performance
Aluminum oxide Al₂O₃ 0.1% - 1.2% Increasing hardness, acid and alkali resistance, weather resistance
Other trace elements -- ≤0.5% Trace impurities such as iron, titanium, zinc, with controllable low residue
Product Series Specifications
ZR-L Series (Low Density)
Specification True Density (g/cm³) Bulk Density (g/cm³) Compressive Strength MPa/psi D50 (μm) D90 (μm) Application
ZR-L15 0.13-0.17 0.08-0.09 4/500 80 120 Daimo, solid buoyancy material, emulsified explosive, automotive repair putty, coating
ZR-L20 0.18-0.22 0.10-0.12 4/500 65 110 Daimo, solid buoyancy material, emulsified explosive, automotive repair putty, coating
ZR-L25 0.23-0.27 0.13-0.15 5/750 65 100 Heat insulation coating, adhesive, solid buoyancy material
ZR-L30 0.28-0.32 0.15-0.18 10/1500 55 85 Heat insulation coating, solid buoyancy material
ZR-L32 0.30-0.34 0.17-0.19 14/2000 45 80 Coating, SMC/BMC, adhesive, putty
ZR-L35 0.33-0.37 0.18-0.21 21/3000 40 70 Oilfield cement slurry, low-density drilling fluid
ZR-L38 0.36-0.40 0.19-0.22 38/5500 40 65 Coating, SMC/BMC, primer, solid buoyancy material
ZR-L40 0.38-0.42 0.19-0.23 28/4000 40 70 Oilfield cement slurry, low-density drilling fluid, heat insulation coating
ZR-L42 0.40-0.44 0.21-0.24 55/8000 40 60 Oilfield cement slurry, low-density drilling fluid
ZR-L46 0.44-0.48 0.23-0.26 41/6000 40 70 Oilfield cement slurry, low-density drilling fluid, SMC/EMC
ZR-L50 0.48-0.52 0.25-0.27 55/8000 40 70 Oilfield cement slurry, low-density drilling fluid
ZR-L60 0.58-0.62 0.29-0.34 83/12000 40 65 Oilfield cement slurry, low-density drilling fluid
ZR-L60a 0.58-0.63 0.30-0.34 124/18000 35 55 Automotive modified plastic, oilfield cement slurry
L type features low density and is commonly used in thermal insulation coatings, as well as for reducing weight and density of composite materials.
ZR-S Series (High Strength)
Specification True Density (g/cm³) Bulk Density (g/cm³) Compressive Strength MPa/psi D50 (μm) D90 (μm) Application
ZR-S20 0.18-0.22 0.10-0.12 7/1000 60 90 Daimo, solid buoyancy material, emulsified explosive, automotive repair putty, coating
ZR-S22 0.20-0.24 0.11-0.13 8/1200 45 70 Daimo, solid buoyancy material, adhesive, automotive repair putty, coating
ZR-S28 0.27-0.30 0.15-0.17 28/4000 45 65 Daimo, solid buoyancy material, adhesive, automotive repair putty, coating
ZR-S38 0.36-0.40 0.19-0.22 38/5500 30 50 Composite circuit board, SMC, adhesive
ZR-S42 0.40-0.44 0.21-0.24 55/8000 25 40 Rubber, shoe material, adhesive, SMC, oilfield cement slurry
ZR-S46 0.44-0.50 0.22-0.25 110/16000 20 30 5G communication materials, PCB circuit board, SMC, plastic
ZR-S60 0.58-0.62 0.29-0.33 193/28000 16 25 5G communication materials, PCB circuit board, SMC, plastic
ZR-S65 0.63-0.67 0.30-0.33 207/30000 13 20 5G communication materials, PCB circuit board, SMC, plastic
ZR-S70 0.75-0.80 0.33-0.35 207/30000 10 15 5G communication materials, PCB circuit board, SMC, plastic
S series represents high-strength applications.
Product Features
  • Ultra-lightweight: Density only 0.13-0.80 g/cm³, maximum weight reduction up to 20-30%
  • High strength: Maximum pressure resistance is 30,000 psi
  • Excellent heat insulation: Hollow and sealed structure, low thermal conductivity, outstanding insulation/cold preservation/fire prevention effects
  • Excellent fluidity: Perfectly spherical shape, easy to disperse, reduce viscosity and easy to process
  • Chemical stability: Inert, resistant to acids and alkalis, oil-resistant, non-absorbent, non-corrosive
  • Low oil absorption rate: Saves resin/adhesive, reduces formulation cost
  • Dimensional stability: Reduces shrinkage, warping, cracking and improves product precision
  • Electric insulation / low dielectric: Suitable for 5G, PCB, high-frequency communication materials
  • Environmentally friendly and non-toxic: Inorganic material, no VOC, complies with export environmental protection requirements
Hollow Glass Microspheres: Ultra-lightweight Thermal Insulation Solution with Chemical Stability for Marine and Industrial Applications 4
Product Applications

Oil and Gas Fields
Low-density cement slurry for well cementing, low-density drilling fluid, deep well/leak-prone well cementing
Advantages: Reduced density, maintained strength, good fluidity, leakage prevention, improved cementing quality

Paint Industry
Reflective insulation paint, thermal insulation paint, industrial anti-corrosion paint, ship/tank body anti-corrosion
Advantages: Heat insulation and cooling, weight reduction, waterproof and anti-fouling, weather resistance, enhanced paint film hardness

Adhesives / Resins / Composite Materials
Epoxy, silicone, acrylic, polyurethane, SMC/BMC, EMC
Advantages: Weight reduction, cost reduction, increased filling volume, enhanced temperature resistance/insulation/dimensional stability

Wood Substitutes / Model Materials
Automobile models, shoe molds, tire molds, architectural models, sculptures, work-in-progress panels
Advantages: Adjustable density, easy processing, dimensional stability, impact resistance, low shrinkage

Plastic Modification / Lightweighting
Automobile parts, home appliance shells, rail transit, high-end polyolefins/engineering plastics
Advantages: Weight reduction, enhanced rigidity, reduced shrinkage, heat insulation and sound insulation, flame retardancy, cost reduction

Rubber Elastomers
Footwear materials, cable sheaths, sealing rings, tire insulation layers, latex pillows/mattresses
Advantages: Lightweight, good rebound, flame retardant, tear-resistant, heat insulation and explosion-proof

5G Communications / Electronics
PCB circuit boards, high-frequency materials, packaging materials, antenna substrates
Advantages: Low dielectric, low loss, high strength, high temperature resistance, dimensional stability

Other High-End Applications
Emulsified explosives (sensitization/density adjustment), solid buoyancy materials, aerospace, marine engineering, cosmetic fillers

Hollow Glass Microspheres: Ultra-lightweight Thermal Insulation Solution with Chemical Stability for Marine and Industrial Applications 5 Hollow Glass Microspheres: Ultra-lightweight Thermal Insulation Solution with Chemical Stability for Marine and Industrial Applications 6 Hollow Glass Microspheres: Ultra-lightweight Thermal Insulation Solution with Chemical Stability for Marine and Industrial Applications 7 Hollow Glass Microspheres: Ultra-lightweight Thermal Insulation Solution with Chemical Stability for Marine and Industrial Applications 8
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